9.
Reduced Worst-Case Communication Latency Using Single-Cycle Multihop Traversal Network-on-Chip
P. Chen, W. Liu, H. Chen, S. Li, M. Li, L. Yang, N. Guan
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), Aug, 2020.
10.
Standing on the Shoulders of Giants: Hardware and Neural Architecture Co-Search with Hot Start [arXiv]
W. Jiang, L. Yang, S. Dasgupta, J. Hu and Y. Shi
International Conference on Hardware/Software Co-design and System Synthesis CODE+ISSS) in ESWEEK'20
(acceptance rate 94/375=25.1%)
also appears at IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), Virtaul Conference, Oct. 2020.
11.
Device-Circuit-Architecture Co-Exploration for Computing-in-Memory Neural Accelerators [arXiv]
W. Jiang, Q. Lou, Z. Yan, L. Yang, J. Hu, X. S. Hu and Y. Shi
IEEE Transactions on Computers (TC), Accepted, 2020.
12.
Hardware/Software Co-Exploration of Neural Architectures [arXiv]
W. Jiang, L. Yang, E. H.-M. Sha, Q. Zhuge, S. Gu, S. Dasgupta, Y. Shi and J. Hu
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), Accepted, 2020.
13.
Co-Exploration of Neural Architectures and Heterogeneous ASIC Accelerator Designs Targeting Multiple Tasks [arXiv]
L. Yang, Z. Yan, M. Li, H. Kwon, L. Lai, T. Krishana, V. Chandra, W. Jiang, and Y. Shi
Design Automation Conference (DAC), 2020.
(acceptance rate 228/992=23.0%)
14.
Co-Exploring Neural Architecture and Network-on-Chip Design for Real-Time Artificial Intelligence (BEST PAPER NOMINATION)
L. Yang*, W. Jiang*, W. Liu, E. H.-M. Sha, Y. Shi and J. Hu
Proc. Asia and South Pacific Design Automation Conference (ASP-DAC), Beijing, Jan. 2020.
(acceptance rate 86/263=32.6%; * equal contribution)